Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agre

Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agreement was signed by AMD CEO Lisa Su and Samsung co-CEO Jun Young-hyun in Pyeongtaek, South Korea.