Taiwan’s Ministry of Economic Affairs approved Taiwan Semiconductor Manufacturing Co.’s plan to deploy its 3nm process at its second fab under construction in Kumamoto, Japan, upgrading from a previously authorized 6–12nm node, according to a ministry statement. The facility, scheduled to begin equipment installation and start operations in 2028, is expected to have a monthly capacity of 15,000 12-inch wafers. The original investment plan of US$5.26 billion was approved in June 2024. TSMC CEO C.

Taiwan’s Ministry of Economic Affairs approved Taiwan Semiconductor Manufacturing Co.’s plan to deploy its 3nm process at its second fab under construction in Kumamoto, Japan, upgrading from a previously authorized 6–12nm node, according to a ministry statement. The facility, scheduled to begin equipment installation and start operations in 2028, is expected to have a monthly capacity of 15,000 12-inch wafers. The original investment plan of US$5.26 billion was approved in June 2024. TSMC CEO C.C. Taiwan authorities also approved an additional US$30 billion investment by TSMC into its financial arm for USD deposits and US Treasuries to enhance returns and manage foreign exchange hedging costs. (Taipei Times)