China International Capital Co said 6G ISAC commercialization—bringing more
channels, higher frequency bands and greater integration—will drive
comprehensive upgrades in RF PCB materials, processes and design, creating
incremental demand across the PCB supply chain. The firm expects penetration of
advanced materials, adoption of more complex processes and rising
multilayer-board demand to support sustained volume and price appreciation in
the communication PCB chain. To accommodate higher-frequency transmission,
copper-clad laminate materials with lower dielectric constant (Dk), lower
dielectric loss (Df) and superior thermal stability will become required, making
upstream high-performance high-frequency materials such as PTFE early
beneficiaries.
