Refinitiv eyewitnesses reported smoke rising after a Ukrainian drone strike on the outskirts of St. Petersburg, Russia.

White House: U.S. will have access to AI "frontier models" before their release.

Samsung Electronics plans to produce HBM5 using chips fabricated on its internally developed 2nm process, targeting mass production around 2028. HPB will be the primary in-package thermal-management technology; HPB is a metal thermal-conduction structure, typically copper-based, integrated into the package and offering roughly 500–1,000x higher thermal conductivity than polymer materials such as substrate, DAF or EMC.