China's ChiNext index fell more than 2%.

Korean tech outlet THEELEC reports SK Hynix has completed production verification of its next‑generation V10 375‑layer 3D NAND and is converting production lines. The company aims for large‑scale mass production in 2026 via upgrades to existing fabs as it seeks to challenge Samsung Electronics' lead in ultra‑high stacking. The V10 design replaces some wordlines' traditional tungsten with molybdenum in the metal interconnect layers; molybdenum is expected to become a key material as 3D NAND advances beyond 600 layers.

厦门空港：公司2026年5月飞机起降15285架次，同比去年下降8.98%。旅客吞吐量220.16万人次，同比下降11.06%。货邮吞吐量2.9万吨，同比下降4.82%