LG Innotek’s packaging solutions head said on the 16th the company will invest 1
tln won to build a semiconductor substrate plant in Vietnam as the first phase
of expanding its packaging substrate business. It is negotiating a second-phase
investment to enlarge FCBGA capacity for AI servers; discussions have made
substantive progress and the company expects to announce scale soon. LG Innotek
also plans additional FCBGA expansion at its Gumi, North Gyeongsang factory in
South Korea beyond a previously announced 600 bln won investment, scaling
production according to customer-agreed volumes.