Qualcomm data‑center business head says Microsoft will deploy the company's high‑bandwidth compute chips in Azure data centers.

Rubio said the US expects Iran to fulfill its obligations.

China International Capital Co (CICC) says proximal (near-chip) heat spreading and liquid cooling are complementary as GPU power for H100, Blackwell and Rubin series climbs past the kW level and 3D packaging raises local heat flux, exposing copper/aluminum thermal limits. Diamond, with ~2,000 W/m·K thermal conductivity and low thermal expansion, can rapidly even out chip hotspots; CICC expects implementations where diamond handles near-chip lateral heat spreading while full liquid cooling removes system- and rack-level heat — a composite diamond-heat-spreader plus full-liquid-cooling solution is likely for future high-end AI servers.