SEMI’s 300mm Fab Outlook projects 2026 global 300mm wafer-fab memory equipment
investment will exceed $52 bln, up 29% YoY, and rise a further 11% to $57 bln in
2027. The report cites increased spending on AI infrastructure, data centers and
next‑generation computing as the driver, reflecting sustained AI‑driven demand
for advanced memory. SEMI forecasts 2024–2029 global 300mm wafer-fab memory
equipment investment will grow at a 19% CAGR. Global 300mm memory capacity is
expected to expand to 4.10 mln wafers/month in 2026 and 4.20 mln wafers/month in
2027.