TrendForce says AI server refreshes and rising volumes of cloud providers’
in-house ASICs pushed high-end MLCC order-to-ship (BB) ratios to new highs in
late June 2026: Murata 1.30, Samsung Electro‑Mechanics 1.31, Taiyo Yuden 1.25,
with the overall MLCC market BB Ratio at 1.04. With new AI chip platforms from
NVIDIA, Google and AMD entering mass production in Q3 2026, capacity is expected
to be increasingly absorbed by AI orders; combined with forward stocking,
TrendForce flags longer lead times and upward pressure on high-end MLCC prices
in H2. It says Q4 2026 will be the key period to determine whether high-end
MLCCs move into sustained shortage.
