Research house projects TSMC’s photonic integrated circuit (PIC) capacity will rise from about 500 wafers/month today to 10,000 wafers/month by Q2 2026, 15,000 wafers/month by Q4 2026 and at least 25,000 wafers/month by 2028. Assuming 648 dies per wafer, annualized PIC die output would climb from roughly 4.0 mln at 500 wafers/month to about 77.8 mln at 10,000 wafers/month and to roughly 194.4 mln at 25,000 wafers/month.

Shanghai municipal government issued the Shanghai Rural Revitalization “15th Five” Plan, targeting substantive progress by 2030: accelerate agricultural modernization, upgrade rural living conditions and deepen urban–rural integration. The plan prioritizes ensuring supply of key agricultural products, ecological conservation, cultural inheritance and rural spatial capacity, and calls for location-specific, classified policy measures. It proposes an urban–rural integration belt around the metropolis and designates Chongming’s three islands, the upper Huangpu River, the north shore of Hangzhou Bay and northern Shanghai as key functional zones, linking these with the Five New Cities and the Yangtze River Delta eco‑green integrated development demonstration area to form a “one belt, four zones, multiple nodes” strategic layout.

Reserve Bank of Australia Assistant Governor Hunter said supply shocks do not diminish the importance of keeping inflation low and stable.