SoftBank Group plans to issue about ¥60bn (≈$369m) of bonds to Japanese
institutional investors this month, offering roughly ¥50bn of 3-year and ¥10bn
of 5-year tranches in the week of July 27, according to lead underwriter Daiwa
Securities. The move underscores growing financing needs; SoftBank earlier
raised ¥678bn via retail subordinated notes and tapped US and European bond
markets in April. Renewed market concern over AI investment returns has weighed
on semiconductor-related names including Arm and pressured SoftBank shares,
which have slipped from early-June highs after reports an OpenAI IPO may be
delayed. SoftBank has been considering using its OpenAI stake as collateral for
margin loans and has scaled planned financing down from $10bn to about $6bn.
