Researchers at the Institute of Metal Research, Chinese Academy of Sciences, together with the Belarusian National Academy of Sciences’ Science‑Practice Materials Research Center and Jiangxi Naile Copper Co., have developed an electrochemical deposition additive‑manufacturing process to in‑situ grow porous copper wicks on Omega‑channel surfaces. Atomic‑scale stacking control produces tunable pore‑size gradients from nanometre to micrometre scales; the resulting gradient electrochemical wick deli

Researchers at the Institute of Metal Research, Chinese Academy of Sciences, together with the Belarusian National Academy of Sciences’ Science‑Practice Materials Research Center and Jiangxi Naile Copper Co., have developed an electrochemical deposition additive‑manufacturing process to in‑situ grow porous copper wicks on Omega‑channel surfaces. Atomic‑scale stacking control produces tunable pore‑size gradients from nanometre to micrometre scales; the resulting gradient electrochemical wick delivers roughly 2x the capillary force of conventional copper‑powder sintered wicks and doubles single‑pipe heat‑dissipation power versus standard grooved tubes. The method addresses integrated manufacturing of Omega channels with graded wicks and is presented as enabling next‑generation high‑thermal‑conductivity copper heat pipes for AI compute‑center cooling.