Shengyi Technology began construction of its second Songshan Lake plant today,
with total investment of about 5.2 bln yuan. The project targets high-frequency,
high-speed materials for AI servers, substrate materials for automotive
electronics, and high-end packaging substrates. On completion it will have
annual capacity of 48 mln sqm of high-performance copper-clad laminates and 100
mln meters of commercial bonding sheets.
