A股算力租赁概念板块表现活跃，利通电子一字涨停，宏景科技、协创数据涨超14%，铜牛信息、网宿科技、东阳光、优刻得跟涨。

【期货盯盘神器专属文章】CBOT农产品晚间分析：美国中西部干旱区终迎大雨，基金削减玉米和大豆净多头头寸，农产品市场风向彻底变了？点击阅读。

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more processors and high-bandwidth memory into larger multi-die packages, advanced packaging has emerged as a key industry bottleneck. Intel’s EMIB uses small silicon bridges to create high-speed links between processors and memory, enabling larger multi-chip AI designs and helping customers diversify supply chains; it has attracted interest from NVIDIA (NVDA.O). Sources say TSMC engineers internally call the work “EMIB-like” and have discussed the solution with some customers.