METI: Japan's June crude oil imports rose 5.9% YoY; total petroleum product sales fell 7.9% YoY; gasoline sales fell 7.1% YoY; kerosene sales fell 14.9% YoY.

Australia Q2 producer-price inflation YoY 3.6%; prior 3.0%.

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more processors and high-bandwidth memory into larger multi-die packages, advanced packaging has emerged as a key industry bottleneck. Intel’s EMIB uses small silicon bridges to create high-speed links between processors and memory, enabling larger multi-chip AI designs and helping customers diversify supply chains; it has attracted interest from NVIDIA (NVDA.O). Sources say TSMC engineers internally call the work “EMIB-like” and have discussed the solution with some customers.