The 27th International Conference on Electronic Packaging Technology (ICEPT2026) will run Aug. 5-7 in Xi'an, showcasing advanced packaging equipment, materials and test solutions. With global advanced-packaging capacity tight, China’s assembly-and-test sector is launching a large-scale expansion; domestic leaders including JCET, Huatian Technology and Tongfu Microelectronics are expanding advanced-packaging capacity and prioritizing high-end memory, power semiconductors and high-performance comp

The 27th International Conference on Electronic Packaging Technology (ICEPT2026) will run Aug. 5-7 in Xi'an, showcasing advanced packaging equipment, materials and test solutions. With global advanced-packaging capacity tight, China’s assembly-and-test sector is launching a large-scale expansion; domestic leaders including JCET, Huatian Technology and Tongfu Microelectronics are expanding advanced-packaging capacity and prioritizing high-end memory, power semiconductors and high-performance computing packaging. The build-out is expected to deepen ecosystem coordination and accelerate domestic self-sufficiency in advanced packaging.