Foreign investment in Japan's semiconductor sector totals 6 tln yen (about $37bn); recent image‑sensor fab announcements from Sony and TSMC will add to overall sector investment. TSMC has committed 3 tln yen to two Japanese wafer fabs — the first began volume production of logic chips in 2024, the second is under construction. Micron last month started an expansion in Hiroshima, planning 1.5 tln yen to produce advanced memory chips for AI data centers. In July Tower Semiconductor said it will in

2026-08-13

Foreign investment in Japan's semiconductor sector totals 6 tln yen (about $37bn); recent image‑sensor fab announcements from Sony and TSMC will add to overall sector investment. TSMC has committed 3 tln yen to two Japanese wafer fabs — the first began volume production of logic chips in 2024, the second is under construction. Micron last month started an expansion in Hiroshima, planning 1.5 tln yen to produce advanced memory chips for AI data centers. In July Tower Semiconductor said it will invest 600 bln yen to mass‑produce optical‑communication chips for data centers.

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2026-08-12

美国和伊朗于6月17日签署14点谅解备忘录,确立停火并设定60天期限谈判永久结束战争。然而数周内,协议因冲突再度升级而出现裂痕。备忘录虽宣布停止敌对行动并开放霍尔木兹海峡供商船通行,但关键条款措辞模糊,双方互相指责违约。主要争议条款如下: 第5条(霍尔木兹海峡):规定保障商业自由通行,但解释存异。德黑兰认为该条款意味着美方承认伊朗对整条水道的管理权,且伊方仅同意免收通行费两个月;美方则坚持文本仅要求伊朗确保安全通行,不得强制执行限制或征税。 第10条(石油与制裁豁免):美方同意发放豁免,使伊朗能够出口原油、石油产品及相关服务,包括国际银行、保险和航运支持。 第11条(解冻金融资产):美方承诺使伊朗被冻结资金和受限资产“完全可供使用”,具体机制将在谈判中商定。 由于双方未展开直接外交对话,且短期内无望就最终解决方案取得实质进展,该备忘录于本周日到期后的前景仍充满不确定性。

2026-08-13

西班牙7月调和CPI月率终值 0%,预期-0.1%,前值-0.10%。