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UK July unadjusted input PPI MoM -1.7% (exp 0.0%); June revised to -1.9% from -2.0%.
2026-08-19
UK July unadjusted input PPI MoM -1.7% (exp 0.0%); June revised to -1.9% from -2.0%.
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其他消息
2026-08-19
On Aug. 19 Dongfeng Commercial Aerospace's Zhuque-3 reusable launch vehicle placed the Honghu-03 satellite into its planned orbit and completed China’s first land recovery of a launcher's first-stage landing legs. The Beijing Rocket Street Commercial Space Intelligent Telemetry, Tracking and Command (TT&C) Center in Yizhuang — the country’s first open commercial TT&C shared platform and located more than 1,000 km from the launch site — entered service the same day and handled full-process satell
On Aug. 19 Dongfeng Commercial Aerospace's Zhuque-3 reusable launch vehicle placed the Honghu-03 satellite into its planned orbit and completed China’s first land recovery of a launcher's first-stage landing legs. The Beijing Rocket Street Commercial Space Intelligent Telemetry, Tracking and Command (TT&C) Center in Yizhuang — the country’s first open commercial TT&C shared platform and located more than 1,000 km from the launch site — entered service the same day and handled full-process satellite and rocket TT&C for the mission.
2026-08-19
JCET said it has achieved a significant advance in high-aspect-ratio through-silicon via (TSV) technology and, with partners, completed sample fabrication. The TSV process targets 2.5D/3D advanced packaging, silicon interconnects and heterogeneous integration, intended to strengthen JCET’s microsystem integration process capabilities and provide one-stop manufacturing support for system-level integration of high-compute, high-memory chips.
JCET said it has achieved a significant advance in high-aspect-ratio through-silicon via (TSV) technology and, with partners, completed sample fabrication. The TSV process targets 2.5D/3D advanced packaging, silicon interconnects and heterogeneous integration, intended to strengthen JCET’s microsystem integration process capabilities and provide one-stop manufacturing support for system-level integration of high-compute, high-memory chips.
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