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US Philadelphia Fed manufacturing shipments index 27.7 in August, down from 33.7 in July.
2026-08-20
US Philadelphia Fed manufacturing shipments index 27.7 in August, down from 33.7 in July.
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其他消息
2026-08-20
As of end-June, Nanjing Bank's nonperforming loan ratio fell 0.01 ppt from end-2025 to 0.82%; provision coverage declined 7.51 ppt to 306.11%. 1H credit impairment losses increased 34.77% YoY. Independent director Qiang Ying told the 2026 interim briefing the YoY rise mainly reflected the bank’s decision to step up risk disposal and clean-up. The bank said it will continue a long-term, prudent, high-quality strategy to maintain an adequate risk buffer and moderate profitability; Qiang said she w
As of end-June, Nanjing Bank's nonperforming loan ratio fell 0.01 ppt from end-2025 to 0.82%; provision coverage declined 7.51 ppt to 306.11%. 1H credit impairment losses increased 34.77% YoY. Independent director Qiang Ying told the 2026 interim briefing the YoY rise mainly reflected the bank’s decision to step up risk disposal and clean-up. The bank said it will continue a long-term, prudent, high-quality strategy to maintain an adequate risk buffer and moderate profitability; Qiang said she will take an active role in governance to oversee compliance, conflict-of-interest issues and protection of minority shareholders.
2026-08-20
Infineon, with partners RT-Thread and Shiyun Technology, launched Edgi-X, an intelligent unmanned-vehicle controller built on Infineon's PSOC Edge E83 dual-core heterogeneous chip as the compute base. The platform targets autonomous motion control across aerial, land and surface vehicles and integrates chip compute, a real-time operating system and model-based development firmware to complete the technical chain.
Infineon, with partners RT-Thread and Shiyun Technology, launched Edgi-X, an intelligent unmanned-vehicle controller built on Infineon's PSOC Edge E83 dual-core heterogeneous chip as the compute base. The platform targets autonomous motion control across aerial, land and surface vehicles and integrates chip compute, a real-time operating system and model-based development firmware to complete the technical chain.
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