出口民调显示，哈萨克斯坦支持总统的阿达勒特党在提前选举中赢得绝大多数席位。

SoftBank Group plans a record ¥1 trillion ($6.3 bln) retail bond offering to help meet its investment commitments to OpenAI. The seven-year bonds are expected to price on Sept. 4 with initial coupon guidance of 4.3–4.9%. SoftBank has pledged more than $60 bln to OpenAI and has been raising funds to support those investments. The group is accelerating data-center spending as demand from OpenAI and hyperscale cloud providers for AI compute rises. This would be SoftBank’s third retail bond sale this year after ¥418 billion in April and ¥260 billion in June.

Major customers have provided 2027 guidance and orders; demand for 1.6T and 800G is expected to remain rapidly higher than in 2026. New products — 2.4T, NPO and XPO — are being developed for scale-out and scale-up applications; company is sampling to large-customer specs with target mass production in H2 2027 and larger-scale shipments in 2028. Management is expanding capacity and preparing core inputs (optical chips, electronic chips and PCBs) to support a 2027 volume ramp.