道琼斯指数9月2日（周三）开盘上涨230.07点，涨幅0.44%，报52996.95点； 标普500指数9月2日（周三）开盘上涨3.42点，涨幅0.04%，报7634.96点； 纳斯达克综合指数9月2日（周三）开盘下跌26.34点，跌幅0.10%，报26073.44点。

TSMC (TSM.N) co-COO Hou Yongqing said quarterly demand for chipmaking equipment has nearly doubled since end-December as the company ramps capacity to meet AI-driven demand. The company has raised its quarterly equipment procurement estimate to about 1.9 times its December forecast. Hou flagged robust demand from AI developers and large-scale global data center buildouts as the main drivers. TSMC is building and equipping roughly 20 fabs in Taiwan and overseas — an unprecedented pace versus its historical norm of 4–5 simultaneous new fabs — and is constrained by a shortage of experienced construction workers. He said the firm is expanding at roughly four to five times its past speed but still cannot meet demand.

U.S. August ADP private payrolls due in 10 minutes.