On Sept. 7 Changxin Technology held its 2026 interim results briefing.
Responding to market reports that Apple tested its chips, CEO Zhao Lun said the
company is open to exploring cooperation with global premium customers and that
its products can compete with international peers on performance, quality and
supply stability. On HBM (high-bandwidth memory), Zhao said Changxin will
continue product and process iteration following its technical roadmap and
commercial plan. He added server demand is robust; Changxin expanded server
business in 1H and contribution from server-facing products increased as
downstream demand picked up. On domestically sourced DUV lithography, the
company said it has taken measures to build the supply chain, focusing on
development and validation of domestic suppliers to coordinate core links such
as semiconductor equipment.
