At its Sept. 10 interim results briefing, Yongxi Electronics said it will maintain a large-customer strategy and, while deepening cooperation with core clients, prioritise expansion, validation and product onboarding for leading overseas accounts and 2.5D advanced-packaging customers in H2 2026. The company said it will steadily build out advanced-packaging product lines — bumping, wafer-level packaging, FC and 2.5D/3D — and continue to enhance one-stop delivery capability via "Bumping+CP+FC+FT"

At its Sept. 10 interim results briefing, Yongxi Electronics said it will maintain a large-customer strategy and, while deepening cooperation with core clients, prioritise expansion, validation and product onboarding for leading overseas accounts and 2.5D advanced-packaging customers in H2 2026. The company said it will steadily build out advanced-packaging product lines — bumping, wafer-level packaging, FC and 2.5D/3D — and continue to enhance one-stop delivery capability via "Bumping+CP+FC+FT".