China August retail sales of consumer goods rose 0.4% YoY, below the 0.8% expected and down from July's 0.6%.

The Ministry of Industry and Information Technology and CHINA STATE PLANNER issued the 15th Five-Year Plan for electronic information manufacturing, prioritizing core-component and product-form advances in consumer electronics, PCs, VR and wearables. For high-end smartphones the plan targets breakthroughs in core chips and high-end display devices and supports R&D of new-form products and differentiated competition. For personal computers it calls for breakthroughs in high-performance chips and development of motherboard architecture design and high-density PCB integration technology. The plan emphasizes wider adoption of flexible displays and advanced packaging to accelerate product-form innovation. For virtual reality it prioritizes near-eye displays, multimodal sensing and interaction, spatial-intelligence technologies, low-power application-specific chips, high-performance microdisplays and optical components, and multi-form terminals. For wearables it seeks breakthroughs in low-power processors, precision sensors, flexible electronic components and substrate-like PCBs, plus lightweight operating systems to broaden supply of watches, bands and rings.

Xinqi Microelectronics said at its 2026 interim results meeting that H2 deliveries of high-end PCB equipment remain full and advanced packaging tools have moved into validation and deployment. The company expects next year's AI-server builds, related substrates and advanced packaging capacity expansions to drive additional equipment demand. Its Phase-II plant ramped in 1H with high capacity utilization and is expected to reach full release in H2; modular production and pre‑stocking of key components will support continued fulfillment of high-end PCB and advanced packaging equipment orders.