美国总统特朗普：看不下去且正在失败的CNN极其不诚实。他们所说的一切都带有针对共和党的倾向。他们确实是“假新闻”！幸运的是，观看他们节目的人非常少！

TrendForce says as GPU vendors and hyperscale cloud providers develop more powerful, feature-rich AI chips, 2.5D packaging development is focusing on larger package area. TSMC’s CoWoS-L faces competition from Intel’s EMIB-T but, due to greater maturity and yield advantages, is expected to remain the mainstream AI chip packaging solution through 2028.

China's State Council Information Office will hold a press briefing at 10:00 a.m. on Sept. 20, 2026, as part of the 'Kick-off: 15th Five-Year' series. Shu Wei, spokesperson and deputy director of the State Administration for Market Regulation, and Yang Sheng, deputy director of the National Medical Products Administration, will outline plans to promote high-quality development of market regulation during the 15th Five-Year period and take questions.