At a Sept. 22, 2026 half-year results briefing, Shengong said it will capitalize
on synchronized domestic and international demand in the semiconductor market,
especially memory chips, and seek a breakthrough in overseas revenue for its
large-diameter silicon materials. The company said it will complete
silicon-components capacity expansion while maintaining quality and output,
optimize its customer mix, and improve profitability and high-quality,
differentiated development of its large-size silicon wafer business.
