VIS inaugurated its first advanced wafer fab in Singapore, VSMC, a joint venture with NXP. Trial production began in June; construction-to-trial took 18 months, well below the typical >2 years. Driven by AI infrastructure demand the new fab’s initial capacity was sold out on start-up and first-batch yields are at least 99%. The plant is slated for mass production in early 2027 and will produce interposers/mid-layers for advanced packaging used by NVIDIA, Google and Broadcom. TSMC holds about a 1

VIS inaugurated its first advanced wafer fab in Singapore, VSMC, a joint venture with NXP. Trial production began in June; construction-to-trial took 18 months, well below the typical >2 years. Driven by AI infrastructure demand the new fab’s initial capacity was sold out on start-up and first-batch yields are at least 99%. The plant is slated for mass production in early 2027 and will produce interposers/mid-layers for advanced packaging used by NVIDIA, Google and Broadcom. TSMC holds about a 19% stake in VIS.