SK Hynix is widening outsourced flip-chip packaging, shifting additional work to Winpac after using OSAT supplier A-Protech; this is the first cooperation between SK Hynix and Winpac in four years. SK Hynix will outsource some DDR4 and DDR5 DRAM packaging orders to Winpac, which has completed equipment commissioning at its P-area packaging plant and moved into mass production. The P-area handles DRAM, NAND flash and eUFS packaging; monthly capacity has increased from 44.0m to 50.0m units.