Samsung Electro-Mechanics will invest nearly $5.1bn through 2028 to expand
production of FC-BGA (flip‑chip ball grid array) substrates, used in AI servers,
robotics and smart-car chips, strengthening Vietnam’s role in AI server and
high-performance computing component manufacturing. The company, an electronic
components unit of Samsung Group, plans 4.27 trillion won (~$3.2bn) for a
Sejong, South Korea plant — its largest single-product investment to date — and
2.51 trillion won (~$1.87bn) for its Vietnam unit; the Vietnam facility, which
ran FC-BGA trials in Thai Nguyen province in 2022, is being scaled to mass
production.
