U.S. 6-month Treasury auction to Oct. 13 — share awarded at the stop-out rate 78.17%, prior 40.62%.

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Hua Microelectronics said at its Oct. 13, 2026 interim results briefing that its eight‑inch wafer line is expanding on schedule and is running at full production and sales with high capacity utilization. Silicon carbide (SiC) PM modules are still in development; SiC IPM modules have entered small‑volume sales. Over the next five years the company will prioritize power semiconductors and related industries, targeting IGBT, MOSFET, diode and wide‑bandgap product lines and accelerating construction of chip and packaging production lines.