Israeli Prime Minister Netanyahu said Israel will continue efforts to eliminate Hamas and Hezbollah’s strike capabilities and prevent them from rebuilding their strength.

China's Premier Li Qiang arrived in Dushanbe on Oct. 18 to begin an official visit to Tajikistan and to attend the 25th meeting of the Shanghai Cooperation Organization Council of Heads of Government (Prime Ministers). He was accompanied by State Councilor and State Council Secretary‑General Wu Zhenglong; Tajik Prime Minister Rasulzoda and senior officials received him.

Seoul Economic Daily reports Samsung Electronics will use TSMC's 3nm process to produce base wafers for NVIDIA's next‑generation custom HBM, marking the first Samsung‑TSMC cooperation at the HBM manufacturing stage. Industry sources say NVIDIA has asked Samsung, SK Hynix and Micron to use TSMC's process for NVHBM base wafers and to adopt sixth‑generation DRAM for the core dies. NVHBM, released in August, integrates NVIDIA's custom memory controller into the substrate to standardize implementation across multiple memory suppliers. Samsung accepted the request after internal review but will continue in‑house production for standard HBM and other customers' custom products, and is evaluating whether its foundry could produce NVHBM base wafers if demand exceeds TSMC capacity.