美国50ETF易方达：将于2026年10月20日开市起至当日10:30停牌，自2026年10月20日10:30复牌。

Samsung Electro‑Mechanics said on the 19th it has signed a long-term supply contract with a global major customer for memory semiconductor packaging substrates worth about 360.5 billion won. The deal brings the company’s cumulative long-term contract wins over the past five months to more than 4 trillion won. Packaging substrates, which connect chips to mainboards and enable high-speed signal transmission, require high-density and fine-circuit manufacturing for high-performance semiconductors. The contract expands Samsung Electro‑Mechanics’ component business: alongside laminated ceramic and silicon capacitors, the company has now secured large orders in packaging solutions.

日本首相高市早苗：对于政府是否会编制追加预算，目前没有任何预设立场。