叙利亚外交部：目前正在与约旦协调，成立一个安全委员会，以制止违规行为并防止其再次发生。

Brazilian stock index futures plunged about 15% and hit the daily down limit after President Lula won the election.

The 24th China Semiconductor Packaging & Test Technology and Market Annual Conference will be held Nov 4-6 at Fengda International Hotel, Nanjing. Leading listed firms including Huatian Technology, Changdian Technology, Tongfu Microelectronics, Nanjing TSMC, Biren Technology, BOE and Yuntian Semiconductor — alongside players in chip design, glass substrates and advanced-packaging equipment — will present at the main forum, technical reports and supply-demand sessions. Organizers emphasize that with Moore’s Law nearing physical limits and rapid AI compute growth, advanced packaging and test technologies are evolving into a strategic growth area that supports chip performance gains and industry innovation.