China's memory‑chip leader ChangXin said on Oct. 30 at its Q3 results briefing that its sixth‑generation DRAM process platform, based on a 4F^2 vertical‑channel architecture, has completed engineering wafer validation. Per industry practice, that indicates core performance metrics have met design targets on real wafers; following customer qualification the platform can proceed to volume production.

2026-10-31

China's memory‑chip leader ChangXin said on Oct. 30 at its Q3 results briefing that its sixth‑generation DRAM process platform, based on a 4F^2 vertical‑channel architecture, has completed engineering wafer validation. Per industry practice, that indicates core performance metrics have met design targets on real wafers; following customer qualification the platform can proceed to volume production.

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