Samsung Electronics chairman Lee Jae‑yong visited the Advanced Packaging Lab
(APL) in Yokohama on the 1st to review next‑generation semiconductor packaging
materials and process R&D and to discuss deeper cooperation with Japanese
materials, parts and equipment suppliers. Samsung established the Yokohama APL
in 2023 and plans to invest ¥40 billion over five years from 2024 (about $254
mln) to develop it as a global advanced‑packaging R&D centre, expand local R&D
headcount to over 100 by 2027, and broaden research into wafer bonding, glass
substrates and other next‑generation packaging technologies.
