美國3月紐約聯儲商業活動指數爲-22.6。

Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agreement was signed by AMD CEO Lisa Su and Samsung co-CEO Jun Young-hyun in Pyeongtaek, South Korea.

巴斯夫：農業解決方案部門投資1700萬歐元，擴建其位於加拿大薩斯卡通的油菜育種創新中心。