據港交所文件：上海仙工智能科技股份有限公司向港交所提交上市申請書。

The global semiconductor industry association SEMI said in its latest forecast that, driven by rising demand from artificial intelligence (AI) and high-performance computing (HPC), glass substrates are expected to enter early production around 2028. SEMI said initial production will target specific high-performance applications and only later expand into broader, more complex semiconductor packaging structures. The association projects the glass substrate market to grow at a 67.2% CAGR from 2028 through 2040.

日本財務大臣片山皋月：預計日本央行將與政府緊密協調。