Mainland A-share auto OEM sector rose; Changan Automobile up 5.7%, SERES up 3.87%, Sinotruk up 2.68%.

Australia Q1 corporate profits -1.3% QoQ, prior +5.8%.

Samsung Electronics plans to produce HBM5 using chips fabricated on its internally developed 2nm process, targeting mass production around 2028. HPB will be the primary in-package thermal-management technology; HPB is a metal thermal-conduction structure, typically copper-based, integrated into the package and offering roughly 500–1,000x higher thermal conductivity than polymer materials such as substrate, DAF or EMC.