Korean tech outlet THEELEC reports SK Hynix has completed production verification of its next‑generation V10 375‑layer 3D NAND and is converting production lines. The company aims for large‑scale mass production in 2026 via upgrades to existing fabs as it seeks to challenge Samsung Electronics' lead in ultra‑high stacking. The V10 design replaces some wordlines' traditional tungsten with molybdenum in the metal interconnect layers; molybdenum is expected to become a key material as 3D NAND advan

Korean tech outlet THEELEC reports SK Hynix has completed production verification of its next‑generation V10 375‑layer 3D NAND and is converting production lines. The company aims for large‑scale mass production in 2026 via upgrades to existing fabs as it seeks to challenge Samsung Electronics' lead in ultra‑high stacking. The V10 design replaces some wordlines' traditional tungsten with molybdenum in the metal interconnect layers; molybdenum is expected to become a key material as 3D NAND advances beyond 600 layers.