慧與科技：HPE數據編織軟件將擴大智能體工作流的數據可用性，將於2026年10月推出。

JP Morgan analysts say bond issuance to finance AI and data centers is likely to remain robust over the coming years. Loans currently cover about 85% of project costs on average; JP Morgan estimates AI-related spending will reach $5.5 trillion by 2030, roughly $4.1 trillion of which is expected to be debt-financed. Issuers are expected to tap capital markets in every country to meet growth financing needs. The bank adds that large tech "super-scale cloud service providers" have sufficient profitability that investors should remain comfortable even as issuance expands, and that these firms are borrowing heavily in part to preserve large cash buffers against potential economic deterioration and higher funding costs.

WTI crude oil dipped to $76/bbl, down 0.92% intraday.