Lenovo Group (00992.HK) proposes to issue $2.0 billion zero-coupon convertible bonds due 2033 and to simultaneously repurchase $675 million of 2.50% convertible bonds maturing 2029; the company also intends to carry out on‑market share buybacks under its repurchase authorization.

Fed Chair Kevin Warsh said he expects a comprehensive review of Fed communications by year-end, covering press conferences, the dot plot and meeting schedules.

AI server, edge AI and high-performance compute demand is forcing power-architecture upgrades and reviving PMIC sector momentum. Tightening mature-process (8‑inch) foundry capacity and recent wafer-foundry price increases are expected to improve IC/PMIC suppliers' pricing power. Selected PMIC vendors reported mixed Jan–May results, but AI power, DDR5 PMICs and fan-motor driver IC demand should help operations reaccelerate in H2. TSMC and Samsung are reconfiguring 8‑inch capacity; limited global 8‑inch supply growth plus rising demand for AI power-management ICs, power components, display drivers and automotive/industrial control is lifting utilization and has prompted some fabs to raise 8‑inch foundry fees, supporting a shift from PMIC cyclical trough toward potential structural recovery.