BofA Securities estimates the global server-CPU-related semiconductor manufacturing market will expand from $15.0 bln in 2025 to $49.0 bln in 2028, with the outsourced production share rising from 52% to 71%, underscoring the strengthening core position of pure-play foundries such as TSMC in high-end CPUs. Scarcity of advanced-node capacity, combined with multi-customer and multi-architecture parallel ramps, makes the foundry segment the clearest beneficiary of the current upcycle. BofA expects

BofA Securities estimates the global server-CPU-related semiconductor manufacturing market will expand from $15.0 bln in 2025 to $49.0 bln in 2028, with the outsourced production share rising from 52% to 71%, underscoring the strengthening core position of pure-play foundries such as TSMC in high-end CPUs. Scarcity of advanced-node capacity, combined with multi-customer and multi-architecture parallel ramps, makes the foundry segment the clearest beneficiary of the current upcycle. BofA expects the server-CPU-related packaging and test market to grow from $1.9 bln in 2025 to $9.6 bln in 2028, lifting its share of the advanced packaging market from 11% to 24%. BofA has raised valuation forecasts for supply-chain leaders including TSMC and ASE Technology, saying advanced process and advanced packaging remain the most defensible parts of the industry chain.