TrendForce's latest survey: wafer foundry capacity is reallocating toward
AI-related products as demand from AI servers, general-purpose servers and edge
AI accelerates, altering mature-node supply/demand. 200mm (8-inch) nodes are
benefiting from incremental Power IC orders and output cuts at TSMC and Samsung,
pushing utilization and contract pricing higher. On 300mm (12-inch) mature
nodes, TSMC-led cutbacks are expected to trigger medium-to-long-term order
shifts. Strong demand for Power ICs at 55nm and above has prompted Taiwanese
foundries to scale back High-Voltage (HV) process output, redirecting orders to
mainland Chinese suppliers. Combined with AI-driven application demand and
raw-material inflation, TrendForce estimates upward pressure on mature-node
foundry prices will persist through 2027.