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市場消息:加拿大總理卡尼將於7月8日至10日訪問沙特阿拉伯。
2026-06-30
市場消息:加拿大總理卡尼將於7月8日至10日訪問沙特阿拉伯。
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其他消息
2026-06-30
CITIGROUP strategists led by David Chew say US tech stocks face further downside as positioning remains elevated: the Nasdaq-100's pullback this month was not matched by a reduction in exposure, leaving long positions still materially larger than shorts and roughly 80% of longs currently underwater. The team warns risk is skewed toward losing long positions, which could amplify downward pressure. AI valuation doubts have triggered tech selling, with large-cap US techs leading and the Nasdaq-100
CITIGROUP strategists led by David Chew say US tech stocks face further downside as positioning remains elevated: the Nasdaq-100's pullback this month was not matched by a reduction in exposure, leaving long positions still materially larger than shorts and roughly 80% of longs currently underwater. The team warns risk is skewed toward losing long positions, which could amplify downward pressure. AI valuation doubts have triggered tech selling, with large-cap US techs leading and the Nasdaq-100 down about 2% this month and on track for its worst June since 2022. Goldman Sachs prime-brokerage data show hedge funds sharply cut US tech exposure last week, with absolute and relative net selling at the highest levels in over a decade. CITIGROUP also flags bearish flows in the Nasdaq-100 and S&P 500 and a rotation into the Russell 2000.
2026-06-30
Applied Materials unveiled a 3D chip-manufacturing equipment line for AI semiconductors targeting advanced packaging flows such as HBM (high-bandwidth memory) stacking, chiplets and hybrid bonding. The portfolio focuses on planarization, deposition and metrology for those processes and includes advanced chemical-mechanical polishing (CMP), electrochemical deposition (ECD) and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, a new electron-beam process-control tool, and an
Applied Materials unveiled a 3D chip-manufacturing equipment line for AI semiconductors targeting advanced packaging flows such as HBM (high-bandwidth memory) stacking, chiplets and hybrid bonding. The portfolio focuses on planarization, deposition and metrology for those processes and includes advanced chemical-mechanical polishing (CMP), electrochemical deposition (ECD) and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, a new electron-beam process-control tool, and an upgraded epitaxy tool aimed at DRAM process applications.
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