開設賬戶
模擬帳戶
關於我們
即時報價及新聞
市場分析
財經日曆
每日市場分析
交易平台
下載及介紹
使用教學
交易細則
各項細則
資金提存
推廣和資訊
常見問題
聯絡我們
繁
简
EN
客户登入
開設賬戶
模擬帳戶
繁
简
EN
客户登入
開設賬戶
模擬帳戶
關於我們
上志國際介紹
上志國際特點
即時報價及新聞
即時報價
即時新聞
市場分析
財經日曆
市場分析
交易平台
平台特點
平台教學
交易細則
各項細則
資金提存
推廣和資訊
常見問題
聯絡我們
關於我們
交易細則
貴金屬市場
交易平台
市場分析
推廣和資訊
常見問題
聯絡我們
繁
简
EN
知情人士:特朗普政府與Anthropic之間並未討論由政府持有該公司的股權。
2026-07-03
知情人士:特朗普政府與Anthropic之間並未討論由政府持有該公司的股權。
返回
其他消息
2026-07-02
Counterpoint Research forecasts 2026 foldable smartphone display panel shipments of about 27.5 mln units, up ~24% YoY, and revenue of roughly $4.4 bln, up ~48% YoY. Growth stems from volume recovery plus Apple entering the segment and a shift to higher-end, large-fold devices. Apple’s first foldable iPhone, expected in H2 2026, should lift panel procurement and boost demand for Samsung Display, high-end large-fold panels and higher-value display technologies. Supply-side: Q1 2026 already shows p
Counterpoint Research forecasts 2026 foldable smartphone display panel shipments of about 27.5 mln units, up ~24% YoY, and revenue of roughly $4.4 bln, up ~48% YoY. Growth stems from volume recovery plus Apple entering the segment and a shift to higher-end, large-fold devices. Apple’s first foldable iPhone, expected in H2 2026, should lift panel procurement and boost demand for Samsung Display, high-end large-fold panels and higher-value display technologies. Supply-side: Q1 2026 already shows panel-maker share divergence; H2 will determine full-year upside. BOE remains the market leader but has lost share; Samsung Display has gained momentum and narrowed the gap.
2026-07-02
The Information reports Anthropic has begun early-stage in-house AI chip development and is in discussions with Samsung Electronics over potential foundry and advanced packaging cooperation, according to three sources. Anthropic is still defining chip role, target performance and server-cluster integration, has engaged multiple chip-design firms, and has not entered detailed design, testing or manufacturing. Sources say Anthropic is considering Samsung’s 2nm process and advanced packaging. The m
The Information reports Anthropic has begun early-stage in-house AI chip development and is in discussions with Samsung Electronics over potential foundry and advanced packaging cooperation, according to three sources. Anthropic is still defining chip role, target performance and server-cluster integration, has engaged multiple chip-design firms, and has not entered detailed design, testing or manufacturing. Sources say Anthropic is considering Samsung’s 2nm process and advanced packaging. The move follows peers’ in-house chip efforts; OpenAI partnered with Broadcom to design chips in 2024 and released the first joint product, Jalapeño, last month.
Chat with us
, powered by
LiveChat