Goldman Sachs raises AMD (AMD.O) PT to $640 from $450.

TrendForce says AI server refreshes and rising volumes of cloud providers’ in-house ASICs pushed high-end MLCC order-to-ship (BB) ratios to new highs in late June 2026: Murata 1.30, Samsung Electro‑Mechanics 1.31, Taiyo Yuden 1.25, with the overall MLCC market BB Ratio at 1.04. With new AI chip platforms from NVIDIA, Google and AMD entering mass production in Q3 2026, capacity is expected to be increasingly absorbed by AI orders; combined with forward stocking, TrendForce flags longer lead times and upward pressure on high-end MLCC prices in H2. It says Q4 2026 will be the key period to determine whether high-end MLCCs move into sustained shortage.

據沙特媒體哈達斯：伊朗議會議長卡利巴夫表示，伊朗認爲儘管存在困難，但與美國達成共識是可能的。