歐盟外交政策高級代表：美國與伊朗之間的交火，使得結束戰爭的談判更加複雜化。

Philadelphia Semiconductor Index falls 5%.

Apple has signed a multi-year agreement with Broadcom to design and produce custom chips and advanced wireless connectivity components for Apple products; the deal is expected to exceed $30 billion. It is expected to drive production of more than 15 billion US-made chips and support hundreds of US jobs. Broadcom will make $1.5 billion in capital expenditures to expand and upgrade its Fort Collins, Colorado manufacturing site to produce FBAR filters, other advanced RF components and wireless connectivity technology. The deal is Broadcom’s largest commitment to date under Apple’s Made in America program.