歐洲央行管委內格爾：在今天的新聞之後，我們回到了最初的起點。

U.S. President Trump said he has spoken with Zelensky slightly less often than he has with Putin.

Research house projects TSMC’s photonic integrated circuit (PIC) capacity will rise from about 500 wafers/month today to 10,000 wafers/month by Q2 2026, 15,000 wafers/month by Q4 2026 and at least 25,000 wafers/month by 2028. Assuming 648 dies per wafer, annualized PIC die output would climb from roughly 4.0 mln at 500 wafers/month to about 77.8 mln at 10,000 wafers/month and to roughly 194.4 mln at 25,000 wafers/month.