U.S. President Trump said on Iran that action against Iran is not about regime change but about nuclear weapons.

Research house projects TSMC’s photonic integrated circuit (PIC) capacity will rise from about 500 wafers/month today to 10,000 wafers/month by Q2 2026, 15,000 wafers/month by Q4 2026 and at least 25,000 wafers/month by 2028. Assuming 648 dies per wafer, annualized PIC die output would climb from roughly 4.0 mln at 500 wafers/month to about 77.8 mln at 10,000 wafers/month and to roughly 194.4 mln at 25,000 wafers/month.

NZD/USD up 0.50% intraday at 0.5705.