Container-shipping Europe-route front-month contract turned lower, trading at 2,400 points after earlier rising more than 4%.

Semiconductor sector shows intra-sector rotation: funds are exiting broad chip names and reallocating into specific supply‑chain nodes. Packaging/test stocks such as Tongfu Microelectronics and JCET Group logged net inflows, while memory and chip‑design names including GigaDevice, Huatian Technology, Beijing Junzheng, Baiwei Memory, Puran and Demingli saw large net outflows. Market takeaway: investors prefer packaging and advanced packaging as nearer‑term beneficiaries of AI compute expansion and onshore substitution order visibility, while memory and consumer‑electronics chains — after earlier gains and with remaining price‑cycle and demand uncertainty — are being taken down for profit.

阿聯酋外交部：對針對科威特邊境哨所和海上石油平臺的侵略性攻擊表示強烈譴責。